CPU

S2 Recommend for Intel® Sapphire Rapids Processor, Socket FCLGA 4677, Aluminum Fin Stack, 5 Heatpipes with Vapor Chamber Base, Passive Cooler for 2U Server and up, Support 350W CPU powered heat dissipation. Note: Dynatron...

S5 Recommend for Intel® Sapphire Rapids Processor, Socket FCLGA 4677, Active Cooler for 2U Server and up, Aluminum Fin stack with 5 Heat Pipes embedded, Side-blow fan with PWM Function, Support 350 Watts CPU Power Heat Dissipation...

A46 Additional Information CPU Socket AM4/AM5 CPU Support AMD® Ryzen Solution 1U & Up Dimensions 110.0 x 80.0 x 26.9 mm Weight

A47 Recommend for AMD® Ryzen Processor Family, Socket AM4 and AM5, 60x60x25 mm PWM Fan, 4 Heat pipes and Aluminum Stacked Fin, Active Cooler for 2U Server and up, Support CPU Power 145 Watts Heat Dissipation. ...

Recommend for Intel® Alder Lake S Processor, Socket LGA 1700, 95 x 95 x 130 mm Fan with PWM function, Heatpipes with Aluminum Base and Aluminum Fin Stack, Active Cooler for 4U Server and Up, Support CPU Power up to 125 Watts Heat Dissipation. ...

U10 Compatible with Intel LGA 1700/1200/115X and AMD Socket AM5/AM4 Processors, Copper Base & Aluminum Fins with Embedded Heat Pipe, 92x92x12mm Axial Fan with PWM Function, Active Cooler for 1.5U Application & Up, Support 125 Watts CPU Power Heat Dissi...

Recommend for AMD® Ryzen Processor, Socket AM4, and AM5, 103 x 103 x 30 mm PWM Fan, HCC (Heatpipe Contact CPU) technology, Active Cooler for 4U Server & Up, Support 170 Watts CPU Base Power and Up to 175 Watts CPU Turbo Power. *Turbo Power is measu...

LGA 1700 Recommend for Intel® Alder Lake S Processor Copper base with aluminum stacked fins plus 4 heat pipes Up to TDP 125W Shin-Etsu 7762 Pre-printed SPECIFICATIONS: Application CPU Socket LGA1700 CPU ...

LGA 1700 Recommend for Intel® Alder Lake S Processor Copper base & aluminum fins with heat pipe embedded Up to TDP 125W SPECIFICATIONS: Application CPU Socket LGA 1700 CPU Recommend for Intel® Alder Lake...

S5R1

CPU SUPPORT AMD CPU SOCKET AMD Socket | SP6/TR5 APPLICATION 3U & UP, Workstations MAXIMUM POWER SP6: 225W sTR5: 350W

This CPU heat sink is designed for Supermicro X11 generation 2U DP servers equipped with Intel® Xeon® scalable processors. The heat sink has been fully tested and validated by Supermicro to ensure the best quality and cooling performance. Manufacturer...

This CPU heat sink is designed for Supermicro X11 generation general 1U servers equipped with Intel® Xeon® scalable processors. The heat sink has been fully tested and validated by Supermicro to ensure the best quality and cooling performance. Manufac...

This CPU heat sink is designed for Supermicro X11 generation general 2U and above servers equipped with Intel® Xeon® scalable processors. The heat sink has been fully tested and validated by Supermicro to ensure the best quality and cooling performance...

SPECIFICATIONS: Application CPU Recommend for AMD® Socket Socket AM4 Technical Data Overall dimension 107 x 78 x 67 mm Weight 400g Heat Sink Material Aluminum Stacked Fin with Heat Pi...

This CPU heat sink is designed for Supermicro X9 generation 1U DP servers equipped with Intel Xeon E5-2400 series processors. The heat sink has been fully tested and validated by Supermicro to ensure the best quality and cooling performance Manufactur...